High Reliability Large Area Substrate Solder Interconnect by Embedded Mesh Technique
Konferenz: PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
16.05.2017 - 18.05.2017 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2017
Seiten: 7Sprache: EnglischTyp: PDF
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Autoren:
Booth, James; Varley, Michael; Slack, David; Mumby-Croft, Paul; Jones, Steve; Dai, Xiaoping (Dynex Semiconductor Ltd., UK)
Vijay, Karthik (Indium Corporation, UK)
Inhalt:
This paper discusses reliability improvements in thermal fatigue to the solder layer between the substrate (Al2O3 ceramic) and baseplate (nickel plated copper) of power semiconductor modules. This includes (i) use of embedded mesh in the solder with earlier demonstrated improvement on bondline uniformity and thermal fatigue for AlN substrate with AlSiC baseplate modules; (ii) alternative solder alloy SnSb5. Passive thermal cycling tests compare samples with the embedded mesh to those with aluminum wire bond spacers (for bondline control). Joint degradation is monitored by SAM scanning. FEA (Finite Element Analysis) simulation is also carried out.