Advanced Cooling Solutions of High Power Automotive Module
Konferenz: PCIM Asia 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
27.06.2017 - 29.06.2017 in Shanghai, China
Tagungsband: PCIM Asia 2017
Seiten: 3Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Qi, Fang; Wang, Yangang; Bob-Manuel, Christiana; Li, Helong; Jones, Steve (Dynex Semiconductor Ltd, UK)
Li, Bo; Chen, Yiyi; Yan, Yuying (University of Nottingham, UK)
Power semiconductor modules play an important role in automotive power-train systems. The automotive module has a higher power density compared with the traditional power semiconductor modules. So in order to improve module reliability and life expectancy, when module package design that thermal management need to focus on. This paper introduces an advanced cooling solution, including module package structure and assembly processes, to improve the module thermal performance include thermal resistance and thermal uniformity, which further increases the power density of the automotive power-train systems. The paper presents a new power semiconductor module baseplate which structure is Vapour Chambers (VP) provide far superior thermal performance than traditional copper baseplate at reduced weight and height. In the paper, designed package trail based on VP been applied, the simulation and experimental results are compared to prove that the solution is feasible.