Advanced IGBT and Packaging Technologies for Next Generation High Power Applications
Konferenz: PCIM Asia 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
27.06.2017 - 29.06.2017 in Shanghai, China
Tagungsband: PCIM Asia 2017
Seiten: 9Sprache: EnglischTyp: PDF
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Autoren:
Tsyplakov, Evgeny; Dugal, Franc; Rahimo, Munaf; Kopta, Arnost; Chen, Makan; Fischer, Fabian; Hartmann, Samuel (ABB Switzerland Ltd, Semiconductors, Switzerland)
Inhalt:
This paper gives an overview of the latest achievements in the area of Si-based turn-off devices for high voltage applications in the power range beyond 10MW. In this paper, we will show an overview of our latest results covering high voltage IGBT/BiGT device and packaging technologies intended for demanding high power converters such as grid, traction, renewables and industrial applications.