Ag paste and application in power devices
Konferenz: PCIM Asia 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
27.06.2017 - 29.06.2017 in Shanghai, China
Tagungsband: PCIM Asia 2017
Seiten: 5Sprache: EnglischTyp: PDF
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Autoren:
Jiu, Jinting (Senju Metal Industry Co., Ltd., Japan & ISIR, Osaka University, Japan)
Takemasa, Tetsu; Ueshima, Minoru (Senju Metal Industry Co., Ltd., Japan)
Suganuma, Katsuaki (ISIR, Osaka University, Japan)
Inhalt:
Ag particles with suitable diameter and diameter distribution were obtained in large-scale by a two-step polyol process. They can be used to make Ag paste for bonding SiC chip to Cu substrate at 250 °C under a small pressure of 0.4 MPa. The obtained Ag joints have high shear strength over 20 MPa, which can endure the thermal-shock test for over 250 cycles. The evolution of shear strength during the thermal-shocking test corresponded to the solvent, which will be discussed in the presentation.