DIPIPM(exp TM) for Automotive Application
Konferenz: PCIM Asia 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
27.06.2017 - 29.06.2017 in Shanghai, China
Tagungsband: PCIM Asia 2017
Seiten: 4Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Wang, Yazhe; Ikeda, Naoki; Hata, Hiroyuki (Mitsubishi Electric Corporation Power Device Works, Japan)
This paper presents the Dual In-line Package Intelligent Power Module (DIPIPM(exp TM)) family that dedicated for Electric Vehicle (EV) and Hybrid Electric Vehicle (HEV) air-conditioner inverter drive application. The DIPIPM(exp TM) product family that targeted for automotive applications adopted the advanced CSTBT(exp TM) power chip technology and embedded into Mitsubishi Electric’s unique insulation-sheet type transfer mold package that is capable to provide the excellent electrical characteristics and superior reliability for automotive application. By using the optimized wafer and assembly process, the DIPIPM(exp TM) achieved a package size that small enough to be able to dramatically shrink the compressor mounting space. Examples of DIPIPM(exp TM) in air-conditioner inverter drive application for electric vehicle that targeted for long drive range and heavy passenger load are introduced.