A Double-Sided Cooling Package Design with Pinfin

Konferenz: PCIM Asia 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
27.06.2017 - 29.06.2017 in Shanghai, China

Tagungsband: PCIM Asia 2017

Seiten: 7Sprache: EnglischTyp: PDF

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Ning, Puqi (Key Laboratory of Power Electronics and Electric Drive,Institute of Electrical Engineering, Chinese Academy of Sciences, University of Chinese Academy of Sciences, China)
Wen, Xuhui (Collaborative Innovation Center of Electric Vehicles in Beijing, China)

A packaging structure for medium power modules featuring power semiconductor switches sandwiched between two symmetric substrates that fulfill electrical conduction and insulation functions is presented. The power switches in a popular phase-leg electrical topology are combined with pinfin structure for double-sided cooling.