A novel high thermal performance insulated package takes power integration to the next level

Inhalt:
High power discrete products in Transistor Outline (TO) packages have started to fill the gap between single switch devices and power modules. The aims of integration and power density increase are reduction of system cost, complexity and stray inductance. In this paper is presented a complete Power Factor Correction (PFC) solution integrated in a novel plug & play insulated molded power package. By providing a reliable thermal path from chip to system heatsink, it enables the highest power density. This PFC solution, which comprises one IGBT and one ultrafast diode, allows higher current capability than any other PFC solution in a molded TO package currently available. Topologies that can be addressed by this package are listed and a possible design complexity reduction for solar application is described. It is an excellent product-to-system example lowering system complexity, development time and assembly costs.