An 820A 750V Compact IGBT Module with New Chip Technology for Automotive Inverter Application
Konferenz: PCIM Asia 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
27.06.2017 - 29.06.2017 in Shanghai, China
Tagungsband: PCIM Asia 2017
Seiten: 5Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Rong, Rui (Infineon Integrated Circuit (Beijing) Co., Ltd., China)
He, YaoHua (Infineon Technologies China Co., Ltd., China)
The Automotive 820A 750V IGBT module in family of HybridPACK (exp TM) Drive is a very compact power module optimized for hybrid and electric vehicle (xEV) main inverter applications. The lead type FS820R08A6P2B power module implements the new IGBT chip generation called Electric Drive Train 2 (EDT2), which is an automotive Micro-Pattern Trench-Field-Stop cell design. The chipset has benchmark current density combined with short circuit ruggedness and increased blocking voltage for reliable inverter operation under harsh environmental conditions. The EDT2 IGBTs also show excellent light load power losses, which helps to improve significantly the system efficiency over a real driving cycle.