High Power Compact Automotive IGBT Module with Planar Packaging Technology
Konferenz: PCIM Asia 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
27.06.2017 - 29.06.2017 in Shanghai, China
Tagungsband: PCIM Asia 2017
Seiten: 5Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Wang, Yangang; Li, Yun; Wu, Yibo; Dai, Xiaoping; Jones, Steve; Liu, Guoyou (State Key Laboratory of Advanced Power Semiconductor Devices, CRRC Times Electric co. Ltd., Power Semiconductor R&D Centre, Dynex Semiconductor Ltd. Lincoln, UK)
Power semiconductor module is the most critical component in the power train system of a Hybrid and Electric Vehicles (HEV/EV). By driving and controlling the electric motor, as well regenerating energy to the battery, power module restricts the overall performance, efficiency, reliability and cost of whole system. Although development of automotive power module is accelerated and various products had been released in last decade, requirement from the automotive customers are becoming more stringent for continuous enhancing the HEV/EV performance. In this work, a new high power compact automotive IGBT module with planar packaging technologies is developed. The design, process and evaluation of the module are addressed. It is supposed that the planar module with dual sided cooled capability has enhanced significantly the thermal, electrical performance and reliability. The prototypes are being qualified by automotive standard and the product will be released shortly.