Development of Accelerated Testing of Thermal Degradation in Metallized Ceramic Substrates for SiC Power Modules

Konferenz: PCIM Europe 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05.06.2018 - 07.06.2018 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2018

Seiten: 7Sprache: EnglischTyp: PDF

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Miyazaki, Hiroyuki; Hyuga, Hideki; Sato, Hiroshi; Yamaguchi, Hiroshi; Hirao, Kiyoshi (National Institute of Advanced Industrial Science and Technology (AIST), Japan)
Iwakiri, Shoji; Hirotsuru, Hideki (Denka, Japan)

In order to shorten the testing time of thermal cycling for metallized ceramic substrates, a new accelerated fatigue test was developed. In this approach, maximum tensile stress in the ceramics during thermal cycle from -40 to 250deg C was estimated by FEM analysis. The stress swing in the ceramic substrates during the thermal cycling was roughly simulated by four-point bending the metallized test piece repeatedly at a frequency of 1 Hz at 250deg C. When the maximum tensile stress caused by the bending was two times larger than that created by the cooling to -40deg C, the time to failure by the repeated external loading for the conventional Si3N4 substrates was less than 1/60 of the time to delamination of the copper plate by the thermal cycling.