Beyond the Datasheet: Commercialization of 700 V – 1.7 kV SiC Devices with Exceptional Ruggedness for Automotive & Industrial Applications

Konferenz: PCIM Europe 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05.06.2018 - 07.06.2018 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2018

Seiten: 7Sprache: EnglischTyp: PDF

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Kashyap, Avinash S.; Gendron-Hansen, Amaury; Sdrulla, Dumitru; Odekirk, Braziluce; Meyer, Dennis; Hong, Changsoo; Brower, William (Microsemi Corp., USA)

Wide bandgap adoption in the automotive and industrial markets has reached an inflection point. While the benefits of using silicon carbide devices are well known, industry is currently grappling with issues such as supply, cost/scaling, and risk evaluation of using them in applications that are mission critical and need high ruggedness. This paper will discuss (a) Microsemi’s design approach to create widespread adoption of SiC devices through rapid commercialization, and (b) key ruggedness metrics based on industry feedback that is not commonly presented in either datasheets or qualification standards, but can potentially unearth underlying device and package weaknesses undermining reliable long-term operation.