Impact of Load Profiles on Power Module Design – a Detailed Analysis Based on 7th Generation of IGBT and Diode Technology
Konferenz: PCIM Europe 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05.06.2018 - 07.06.2018 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2018
Seiten: 8Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Buschhorn, Stefan; Brodt, Anastasia; Lenze, Andre; Philippou, Alexander; Jaeger, Christian; Laven, Johannes; Sahan, Benjamin; Mueller, Christian (Infineon Technologies AG, 59581 Warstein, Germany)
With focus on drives applications, the interaction between operating conditions and power module performance is analyzed. For different current and overload levels, the effect on junction temperature and temperature ripple is highlighted, and the impact of the heat sink design on the power module performance is derived. Based on an exemplarily chosen system, the interaction between heat sink and thermal stress is described, and the potential advantages of a temporary operation at elevated junction temperatures, e.g. 175deg C, are presented. Finally, these results are applied to typical inverter designs, where one system has to support different load profiles.