Directly Cooled HybridPACK Power Modules with Ribbon Bonded Cooling Structures
Konferenz: PCIM Europe 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05.06.2018 - 07.06.2018 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2018
Seiten: 6Sprache: EnglischTyp: PDF
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Autoren:
Uhlemann, Andre; Hymon, Erwin (Infineon Technologies AG, Germany)
Inhalt:
In this paper a new way of direct fluid cooling for power modules is presented. The cooling concept uses flat base plates with ribbon bonded cooling structures. It is characterized by high flexibility and a thermal performance being comparable to conventional pin fin base plates. Furthermore the electrochemical compatibility of the new cooling concept and its flexible thermal design are demonstrated in detail.