Enhanced Module Design with DPD Technology

Konferenz: PCIM Europe 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05.06.2018 - 07.06.2018 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2018

Seiten: 5Sprache: EnglischTyp: PDF

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Bellu, Roberto; Goebl, Christian; Maul, Andreas; Vennebusch, Clemens (Semikron Elektronik GmbH, Germany)

Reliability of power modules is today even more stressed than in the past, because of new application fields requiring less weight and size though increased performance, robustness and environmental harshness. This paper introduces the “DPD – Direct Pressed Die” technology as evolution of the SKiiP pressure contact technology and shows how these new requirements mentioned before can be fulfilled in the design of a power module.