New Transfer Mold SMD Type IPM with Integrated RC-IGBT, Bootstrap Diode and Capacitor

Konferenz: PCIM Europe 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05.06.2018 - 07.06.2018 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2018

Seiten: 4Sprache: EnglischTyp: PDF

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Wang, Yazhe; Hasegawa, Maki (Mitsubishi Electric Corporation Power Device Works, Japan)

A new transfer mold Surface Mount Device (SMD) type Intelligent Power Module (IPM) developed for small capacity motor drive in home appliance products such as refrigerator, dishwasher, fans etc. that compact size and high reliability are pursued is presented in this paper. By utilizing new packaging technology and thin wafer Reverse Conducting IGBT (RC-IGBT) the new SMD type IPM successfully incorporated not only three-phase IGBT bridge and gate-driver ICs but also Bootstrap components like BSDs etc. into a very compact surface mount type package. Additional built-in protection features include interlocking, analog temperature signal output, over current, under voltage etc. The module is manufactured by transfer-mold technology that is capable to provide superior matching of thermal expansion coefficient and achieved a package size that small enough to help to dramatically minimize overall size and complexity of the inverter drive system. As a result, the device greatly simplifies and shortens the process of designing the inverter power stage of home appliance products.