Application of MMC AISiC Thermocompensators in Power Press Pack Diodes and Thyristors
Konferenz: PCIM Europe 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05.06.2018 - 07.06.2018 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2018
Seiten: 4Sprache: EnglischTyp: PDF
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Autoren:
Grishanin, Alexey; Martynenko, Valentin; Eliseev, Vyacheslav; Malygin, Mikhail; Samoylov, Anton; Nishchev, Konstantin (JSC Electrovipryamitel, Russia)
Novopoltsev, Mikhail; Plotnikov, Alexander (Mordovia State University, RU)
Inhalt:
This paper presents investigation and test results of power press–pack semiconductors with thermocompensators from metal-matrix composite (MMC) AlSiC and brief description of design and manufacturing technology.