A Development of Resin Insulating Material for High Reliable Enhanced Power Module

Konferenz: PCIM Europe 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05.06.2018 - 07.06.2018 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2018

Seiten: 3Sprache: EnglischTyp: PDF

Persönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt

Amanuma, Shinji; Togawa, Mitsuo (Hitachi Chemical, Japan)

The race to develop next generation power module has been intensified. The design of power module should be not only applying much high power density but also the well-considered thermal management of its structure, while expanding its coverage to energy harvesting, industrial robot and automotive application. This paper proposes several key organic insulating materials namely, Resin insulated high heat dissipation substrate, High heat resistance encapsultant for case module, High heat resistant coating material in order to satisfy these requirements. The feasibility of this packaging concept shown better performance compare to conventional module design. Applied much higher current, excellent heat dissipating, superior mechanical reliability and simple module structure.