Performance Comparison Between Surface-Mount and Embedded Power Modules

Konferenz: PCIM Europe 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05.06.2018 - 07.06.2018 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2018

Seiten: 5Sprache: EnglischTyp: PDF

Persönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt

Weis, Gerald (AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, Austria)

Increasing efficiency in power electronic circuits requires innovative cooling concepts and a low impedance connection in the power path as well as low inductance driving circuits placed as close as possible to the main power switches. A direct comparison between state-of-the-art standard surface-mount build-ups and directly embedded power switches into the printed circuit board shows the high potential of integrated electronics. Measurements at defined operating points verify improved thermal performance due to more heat spreading area as well as higher achievable switching speed.