PCB-Embedding of Power Dies Using Pressed Metal Foam

Konferenz: PCIM Europe 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05.06.2018 - 07.06.2018 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2018

Seiten: 8Sprache: EnglischTyp: PDF

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Pascal, Yoann; Labrousse, Denis; Petit, Mickael; Lefebvre, Stephane (SATIE, École normale supérieure Paris-Saclay, Cachan 94230, France & SATIE, Conservatoire National des Arts et Métiers, Paris 75003, France)
Costa, Francois (SATIE, École normale supérieure Paris-Saclay, Cachan 94230, France & SATIE, Université Paris Est Créteil, 94000 Créteil, France)

This paper presents a new technique to manufacture the top-side contact of a PCB-embedded power die, using a pressed piece of metal foam. The manufacturing process is detailed, prototypes are manufactured and electrically characterized, and the technique is used to embed a switching cell with a 1.7 nH switching loop. This process is easy to make and highly cost-effective; the electric resistance of the assembly is close to that of a state-of-the-art industrial package using bond wires, moreover the stray inductance is minimized.