Direct Power Board Bonding Technology for 3D Power Module Package
Konferenz: PCIM Europe 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05.06.2018 - 07.06.2018 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2018
Seiten: 5Sprache: EnglischTyp: PDF
Persönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Autoren:
Ishibashi, Hidetoshi; Yoshida, Hiroshi; Murata, Daisuke (Mitsubishi Electric Corporation Power Device Works, Japan)
Morisaki, Shota; Rokubuichi, Hodaka (Mitsubishi Electric Corporation Advanced Technology R&D Center, Japan)
Asaji, Nobuhiro (Mitsubishi Electric Corporation Component Production Engineering Center, Japan)
Inhalt:
Power module is used in a wide range of fields such as, home appliance, industry, railway, automobile, renewal energy, and so on. Recently, it is increasing to be required miniaturization of footprint and higher reliability to power modules. This paper introduces the new package technology has the Power board (thicker copper printed circuit board) as inner connection instead of the conventional wire connection. This technology leads further downsizing, lower package stray inductance, and robustness to answer the market requirements.