Vibration Damping of Portable Devices by Superelastic SMA Foils
Konferenz: ACTUATOR 2018 - 16th International Conference on New Actuators
25.06.2018 - 27.06.2018 in Bremen, Deutschland
Tagungsband: ACTUATOR 2018
Seiten: 5Sprache: EnglischTyp: PDF
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Autoren:
Jacob, K.; Kohl, M. (Karlsruher Institut für Technologie, Karlsruhe, Germany)
Ahmadi, S. (Karlsruher Institut für Technologie, Karlsruhe, Germany & Friedrich-Alexander Universität Erlangen-Nürnberg, Fürth, Germany)
Wendler, F. (Friedrich-Alexander Universität Erlangen-Nürnberg, Fürth, Germany)
Miyazaki, S. (University of Tsukuba, Tsukuba, Japan)
Inhalt:
We report on the design, fabrication and performance of novel vibration damping devices based on a superelastic shape memory alloy (SMA) foil of TiNiFe. SMA damping devices are designed as wheel-shaped microbridges with a movable platform in the centre that acts as an interface for mechanical loading in out-ofplane direction. Damping force and deflection are adjusted by the geometry of the SMA microbridges and by applying a pre-strain through mechanically coupling and deforming two SMA microbridges via a cylindrical mass at their centres. The free vibration characteristics of the SMA damping devices are characterized with respect to pre-strain and initial deflection. At large pre-strain, dynamic energy dissipation due to high strain rates reveals a high damping capacity of up to 0.92, which is about a factor of 4 higher compared to corresponding energy dissipation under quasi-stationary loading.