A New Generation of Minimized 1200V Intelligent Power Module for the Low and Medium Power Motor Drive Applications

Konferenz: PCIM Asia 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
26.06.2018 - 28.06.2018 in Shanghai, China

Tagungsband: PCIM Asia 2018

Seiten: 4Sprache: EnglischTyp: PDF

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Lee, JunHo; Lee, SeungJae; Jeong, JinYong; Kwon, TaeSung; Lee, KiHyun; Bae, HyunSoo (ON Semiconductor, Korea)

This paper presents a new generation of 1200V IPM (Intelligent Power Module) in minimized DIP (Dual-in line-Package) of transfer molded type with extremely high thermal conductive type of DBC (Direct Bond Copper), which combines with the features of ON Semi’s rugged trench technology IGBT, fast reverse recovery diodes and optimized gate drivers to achieve the excellent solution for up to 3kW motor drives. This paper provides an overall description of the new generation of 1200V IPM as well as electrical characteristics, package structure, thermal performance and allowable power ratings.