High Power next Core (HPnC) package with 3.3kV SiC Hybrid chip combination
Konferenz: PCIM Asia 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
26.06.2018 - 28.06.2018 in Shanghai, China
Tagungsband: PCIM Asia 2018
Seiten: 8Sprache: EnglischTyp: PDF
Persönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Autoren:
Sekino, Yusuke; Iso, Akira; Harada, Yuichi; Moriya, Tomohiro; Iwamoto, Susumu; Kakiki, Hideaki; Ikawa, Osamu (Fuji Electric Co., Ltd., Japan)
Inhalt:
Recently main requirements for power conversion system are further downsizing and higher efficiency. In order to satisfy these requirements, enhanced power density of power modules should be the key to succeed. In this paper, 3.3kV SiC-Hybrid module with High Power next Core package, which can realize lower switching loss than Silicone, has been described.