Extended Lifetime of a new IGBT Module for Traction Applications

Konferenz: PCIM Asia 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
26.06.2018 - 28.06.2018 in Shanghai, China

Tagungsband: PCIM Asia 2018

Seiten: 4Sprache: EnglischTyp: PDF

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Demuth, Volker (SEMIKRON GmbH & Co. KG, Germany)

A new standard power semiconductor module with extended lifetime for traction applications is presented. Using next level technologies like sinter die attach and an improved wire bonding, the power cycle capability can be increased by a factor of 2 to 3 compared to conventional package technologies for traction. Not only the overall product lifetime is extended but also the robustness under overload conditions is greatly increased, leading to lower life cycle cost and higher power density.