New package design to enhance the reliability performance of power module

Konferenz: PCIM Asia 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
26.06.2018 - 28.06.2018 in Shanghai, China

Tagungsband: PCIM Asia 2018

Seiten: 3Sprache: EnglischTyp: PDF

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Jian, Sun; Gaosheng, Song; Xiankui, Ma (Mitsubishi Electric & Electronics (Shanghai) Co., Ltd. China)

Reliability performance is a very important factor to power module, especially for power module works at bad working environment, such as wide range of working temperatures, high moisture, vibration, etc., which raise a high requirement to package design of power module. This paper shows a new type package design and its contribution to reliability performance of power module.