MiniSKiiP Dual Enables High Power Density Motor Drive up to 90kW
Konferenz: PCIM Asia 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
26.06.2018 - 28.06.2018 in Shanghai, China
Tagungsband: PCIM Asia 2018
Seiten: 5Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Li, Yufeng; Jing, Wei (SEMIKRON Electronics (Zhuhai) Co. Ltd., China)
Pluschke, Norbert (SEMIKRON Hong Kong Co. Ltd., China)
High power density brings the advantages of compact size and low cost, which becomes the technical trend for next generation variable frequency drive. This paper introduces a new 90kW motor drive solution based on Semikron MiniSKiiP Dual module. In this new design, conventional bus bar and copper bar connections are replaced by just one PCB on which all power components are integrated. Thanks to the spring contact technology of MiniSKiiP family, a quick and easy assembly process can be realized. The new solution based on MiniSkiiP Dual module makes the labor cost lower than the one using standard modules. Compared with conventional design, the new solution can bring the benefits of a volume reduction by 50% and a cost reduction up to 20%.