Best fit between baseplate geometry and ceramic thickness to achieve excellent thermal performance
Konferenz: PCIM Asia 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
26.06.2018 - 28.06.2018 in Shanghai, China
Tagungsband: PCIM Asia 2018
Seiten: 4Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Shen, Song; Zheng, Ziqing (Infineon Technologies Co., Ltd., China)
Zhao, Jia (Infineon Integrated Circuit (Beijing) Co., Ltd., China)
With the electrification of vehicles, the increasing demand for renewable energies and the need to reduce energy consumption, the demand for power electronics is increasing. To satisfy this demand, it is important to offer IGBT modules composed of materials from multiple sources and with similar cost-performance ratios to allow greater flexibility for customers. In this publication, a comparison between two different EconoDUAL(TM) 3 modules with different ceramic and baseplate geometry is presented.