MICROPRINCE- Open access pilot line for Micro-Transfer-Printing of functional components on wafer level
Konferenz: Smart Systems Integration - 13th International Conference & Exhibition on Integration Issues of Miniaturized Systems
10.04.2019 - 11.04.2019 in Barcelona, Spain
Tagungsband: SmartSystems Integration
Seiten: 2Sprache: EnglischTyp: PDF
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Autoren:
Wicht, Sebastian; Krieger, Uwe; Guenther, Daniela; Heise, Niclas (X-FAB MEMS Foundry GmbH, Haarbergstr. 67, 99097 Erfurt, Germany)
Krojer, Matthias; Kittler, Gabriel (X-FAB Semiconductor Foundries GmbH, Haarbergstr. 67, 99097 Erfurt, Germany)
Naumann, Falk; Altmann, Frank (Fraunhofer IMWS, Walter-Huelse-Str.1, 06120 Halle, Germany)
Gomez, David (X-Celeprint US, Research Triangle Park NC, USA)
Fecioru, Alin (X-Celeprint Ireland, Dyke Parade Cork, Ireland)
Inhalt:
Micro-transfer-printing (muTP) represents a versatile micro-assembly technology which has been developed in laboratory and (for photo-voltaic application) in an industrial environment over the last ten years. Within the European funded ECSEL project “MICROPRINCE” the worldwide first open access pilot line for muTP will be installed in the clean room facilities of the X-FAB MEMS Foundry GmbH. Moreover, the project possesses the objective to demonstrate the capabilities of this pilot line for heterogeneous integration of different application scenarios. Therefore, functional components for several target applications will be transferred and assembled on wafer level and the benefits of the muTP technology will be explained.