Fiber-chip coupling for advanced microsystems

Konferenz: Smart Systems Integration - 13th International Conference & Exhibition on Integration Issues of Miniaturized Systems
10.04.2019 - 11.04.2019 in Barcelona, Spain

Tagungsband: SmartSystems Integration

Seiten: 4Sprache: EnglischTyp: PDF

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Moeller, Christian; Ortlepp, Hans-Georg; Neckermann, Kristin; Klein, Thomas; Ortlepp, Thomas (CiS Forschungsinstitut für Mikrosensorik GmbH, Konrad-Zuse-Straße 14, 99099 Erfurt, Germany)

Fiber coupling of optical microsensors offer advantages like increased sensitivity and geometric versatility to enable application in high voltage, electrically noisy, high/low temperature and many others. In this paper we introduce a silicon wafer based fiberchip coupling. Optical sensors can be coupled with a silicon carrier wafer via flip-chip mounting. The silicon carrier wafer enables electrical contact to the sensor and a defined optical fiber mounting. As examples for the technology, we present a flip-chip assembly of a superconducting single photon detector and a miniaturized fiber Bragg grating sensor.