Very-Thin System-in-Package Technology for Structural Analysis
Konferenz: Smart Systems Integration - 13th International Conference & Exhibition on Integration Issues of Miniaturized Systems
10.04.2019 - 11.04.2019 in Barcelona, Spain
Tagungsband: SmartSystems Integration
Seiten: 8Sprache: EnglischTyp: PDF
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Autoren:
Hopsch, Fabian; Heinig, Andy (Fraunhofer IIS-EAS, Zeunerstraße 38, Dresden, Germany)
Boettcher, Mathias (Fraunhofer IZM-ASSID, Ringstraße 12, Moritzburg, Germany)
Inhalt:
The trend in integrated circuit and package technology for the recent decades was to integrate more and more functionality on same area. It seem like this trend slowed down, because the effort to continue rises dramatically. With the rising 3D-packaging technologies the trend for integration continues to the 3rd dimension. But with this trend also the demand for limiting the dimensions of the systems arises in many application fields, where space in certain regions is limited. Some applications arise because it is possible to integrate some kind of system in very dense area. There were developments to thin systems decades ago, but these packages can’t cope with the demands for nowadays system.