Advanced Sensing with Assembled, Packaged and Embedded Technologies

Konferenz: Smart Systems Integration - 13th International Conference & Exhibition on Integration Issues of Miniaturized Systems
10.04.2019 - 11.04.2019 in Barcelona, Spain

Tagungsband: SmartSystems Integration

Seiten: 5Sprache: EnglischTyp: PDF

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Toda, Masaya (Graduate School of Engineering, Tohoku University, Sendai, Japan)

3D structures of MEMS devices will have more possibility to develop new functionalities and challenging researches. There are many methods to make 3D structures using bending and folding of films, even buckling, curving or twisting phenomena of materials. Desired 3D structure gives new functions like stress compensation and high-Q micro wave inductors etc. following more highly functionalized electrical and electromagnetic and energy devices using residual stress, capillary forces and manipulations. Such 3D geometries can be programmed by using 2D patterning. Self-assembled manufacturing is important for their mass productions. On the other hand, handling elements one by one to develop a 3D structure should increase the cost of production and the price of systems. However, for prototype productions, even element productions for high end devices, the huge number of fabrication in factory is not the necessarily requirement. In this report, the possibility of assembled devices for smart sensing systems needs to be discussed as shown in Figure 1, using a manipulator to mount a magnet particle on a Si cantilever sensor, and building a XYZ-micro-stage using a metallic holder and a block as assembling technologies for functional device by bottom-up processes, additionally including a coating method to form the embedded diamond-nano-particles as magnetic sensing layers.