On the Thermal Performance of Si3N4-Based Ceramic Multilayer Substrates

Konferenz: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.05.2019 - 09.05.2019 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2019

Seiten: 8Sprache: EnglischTyp: PDF

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Welker, Tilo; Rüppel, Markus; Herrmann, Rainer; Mathieu, Olivier; Polster, Sebastian; Meyer, Andreas (Rogers Germany GmbH, Germany)

Ceramic multilayer substrates represent efficient platforms for liquid cooled, compact, and low inductive power modules with fast switching semiconductors. This work shows how their thermal performance can be optimized. It is demonstrated with simulations and measurements that a thick copper layer in the middle of the layer stack serves as a heat spreader and thermal buffer. Integrating a cooler at the back of the substrate allows for omitting thermally unfavorable solder layers, while reducing the overall package size. Thus, additional ceramic layers can be compensated for. In combination with a customized cooling jacket, the introduced multilayer substrate shows improved thermal performance of up to ~25 % compared to state-of-the-art solutions.