Trend in Thermal Resistance of Advanced Power Modules
Konferenz: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.05.2019 - 09.05.2019 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2019
Seiten: 5Sprache: EnglischTyp: PDF
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Autoren:
Shishido, Nobuyuki (Green Electronics Research Institute, Kitakyushu, Japan)
Tsukuda, Masanori (Green Electronics Research Institute, Kitakyushu, Japan & Kyushu Institute of Technology, Japan)
Nishizawa, Shin-ichi (Research Institute for Applied Mechanics, Kyushu University, Japan)
Inhalt:
Thermal management is essential to reliable design of power modules. In this report, a trend in the thermal resistance of power modules was examined by reviewing the current cooling technologies. The thermal resistance of power modules has decreased to approximately 1/3x in 10 years. Our numerical simulation about cooling suggests that a straightforward development in liquid cooling technology can achieve the update corresponds to the expected change in next 5 year when it keeps this trend in next decades. However, further progress in thermal resistance shall require higher thermal-conductive materials for spreader and two-phase cooling technologies.