High-Power SiC and Si Module Platform for Automotive Traction Inverter

Konferenz: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.05.2019 - 09.05.2019 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2019

Seiten: 8Sprache: EnglischTyp: PDF

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Schuderer, Juergen; Liu, Chunlei; Pavlicek, Niko; Salvatore, Giovanni; Loisy, Jean-Yves; Schroeder, Arne; Torresin, Daniele; Gradinger, Thomas; Baumann, David; Mohn, Fabian (ABB Corporate Research, Switzerland)
Apelsmeier, Andreas (AUDI AG, Germany)

A novel power semiconductor module platform for the automotive powertrain is presented in this paper. Mold modules are designed for symmetric and minimized parasitics by applying alternating and multilayer current routing. All interconnects are solder-free to provide superior reliability, and to meet present and future automotive requirements, e.g., passing 1000 temperature shock cycles in the range of -40 to 150 °C. SiC or Si devices are packaged in the same external outline offering a simple scalability for inverter classes in the 150 – 350 kW power range. A screw-less and O-ring-less 3-phase inverter module is achieved by a laser welding of the mold modules to a low-cost Al cooler enclosure.