Investigating the mold compounds influence on power cycling lifetime of discrete power devices

Konferenz: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.05.2019 - 09.05.2019 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2019

Seiten: 8Sprache: EnglischTyp: PDF

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Otto, Alexander; Dudek, Rainer; Doering, Ralf; Rzepka, Sven (Fraunhofer ENAS, Technologie-Campus 3, 09126 Chemnitz, Germany)

Recently performed lifetime modelling based on various power cycling tests, including tests with superimposed passive thermal cycles, indicated a strong influence of the mold compound with its characteristic glass transition temperature Tg on the failure mechanism wire-bond lift-off within discrete power device packages. The paper reports the discussion of this influence on the lifetime modelling and details its investigation. It also includes electro-thermo-mechanical finite element simulations as well as the introduction of a new optical in-situ analysis method capable of visualizing the in-plane deformations and strains in the package during power cycling.