Reliability test results of PCB soldered GaN GIT devices
Konferenz: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.05.2019 - 09.05.2019 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2019
Seiten: 8Sprache: EnglischTyp: PDF
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Autoren:
Boldyrjew-Mast, Roman; Kretzschmar, Danny; Franke, Joerg; Lutz, Josef (Chemnitz University of Technology, Reichenhainer Str. 70, 09126 Chemnitz, Germany)
Inhalt:
Several tests have been performed to analyze the reliability of GaN GITs soldered on printed circuit boards, including a high temperature gate bias test, a high temperature reverse bias test, a high voltage high humidity high temperature reverse bias test and a power cycling test. Furthermore, four temperature-sensitive electrical parameters have been compared with the results of the power cycling tests for the RDS(on)-method. Finally, a failure analysis has been performed for specimens which have reached end of life in the power cycling test.