Silver alloy wire bonding interconnection technology used in Power Module

Konferenz: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.05.2019 - 09.05.2019 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2019

Seiten: 4Sprache: EnglischTyp: PDF

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Sakutani, Kazuhiko; Kondo, Satoshi; Shikano, Taketoshi (Mitsubishi, Electric Corporation Power Device Works, Japan)
Yamazaki, Koji (Mitsubishi, Electric Corporation Advanced Technology R&D Center, Japan)

Wire bonding is still main interconnecting technology for power modules as its design flexibility. Aluminum wire and gold wire are widely applied to power part and control part. To complete the strong market demand of downsizing and higher cost performance, internal connecting technologies have been developed. Silver-alloy wire is the suitable material because of better electrical conductivity than aluminum and inexpensive than gold and higher resistance to oxidation than copper. After enough evaluation of silver migration and corrosion in high temperature, the power module with silver-alloy wire was developed. Silver-alloy interconnecting technologies will contribute to the market demands.