New, best-in-class 900-A 1200-V EconoDUAL™ 3 with IGBT 7: highest power density and performancend performance
Konferenz: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.05.2019 - 09.05.2019 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2019
Seiten: 8Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Vogel, Klaus; Baurichter, Jan; Lenze, Oliver; Nolten, Ulrich; Philippou, Alexander; Ross, Philipp; Schmal, Andreas; Urban, Christoph (Infineon Technologies AG, Germany)
The development of the new semiconductor generation targets current density increase with the aim to reduce system costs for inverter manufacturers. It is crucial to implement the new technology in a given module footprint to facilitate the upgrade of existing inverter systems. This approach leads to a fast market penetration. The switching characteristics of the improved IGBTs and diodes have to fit the characteristics of the selected module housing. This is true, especially with regard to oscillation behavior, since the module current is higher, and the reduction of module stray inductance is limited. At the same time, improving the housing is an important consideration to be able to handle higher currents and temperatures. For the user of the new device, the benefits are clear: higher inverter output current for the same frame size, and avoidance of paralleling of IGBT modules. Both possibilities lead to the simplification of the inverter systems and to lower costs. In this paper, all the technical aspects of the new EconoDUAL(TM) 3 with TRENCHSTOP(TM) IGBT 7 medium-power and corresponding emitter-controlled 7 diode for general-purpose drives application will be discussed.