Thermal Performance Comparison between New 650V Automotive Smart Power Module and Conventional Automotive Discrete IGBT
Konferenz: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.05.2019 - 09.05.2019 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2019
Seiten: 5Sprache: EnglischTyp: PDF
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Autoren:
Jo, David; Jang, Shawn; Lee, Kangyoon; Yim, Thomas; Lee, ByoungOk; Lee, JunHo (On Semiconductor, South Korea)
Inhalt:
This paper presents thermal performance comparison between new 650V/50A ASPM (Automotive Smart Power Module) and conventional automotive discrete IGBT. Automotive power device needs automotive qualification such as AEC and AQG-324. Especially, in the automotive power system, IGBT junction temperature is main key factor because it affects the life time of the inverter system. To meet the automotive qualification and high thermal performance, On Semiconductor developed the new 650V/50A ASPM27. ASPM27 obtain the automotive qualification (AEC & AQG-324). And also ASPM27 achieves the high thermal performance through the high thermal conductive DBC (Direct Bond Copper) substrates compare with conventional automotive discrete IGBT solution. This paper provides a basic structure of ASPM27 as well as adopted high thermal conductive DBC structure, thermal performance comparison test result between ASPM27 and conventional automotive discrete IGBT.