Thermal Behavior of the High power automotive dual sided cooled Module

Konferenz: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.05.2019 - 09.05.2019 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2019

Seiten: 6Sprache: EnglischTyp: PDF

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Vangaveti, Udaykumar; Tamma, Pradeep Kumar; Mookken, John (On Semiconductor, Germany)

This paper will focus on the thermal performance of the 800A, 750V VE-TracTM Dual Side Cooled (DSC) module. The thermal performance (Zth-JF) of the DSC module is compared to the traditional single side direct cooled module with pin-fins. The thermal resistance (Rth-JC) of the IGBT and diode chips of the DSC module are measured using the Thermal Dual Interface Method (TDIM). The DSC module technology not only offers improved thermal performance but also eliminates traditional wire bonds which have the potential to improve reliability and lower costs in the end application.