Using the case temperature to identify the Cauer-type thermal parameters of IGBT module

Konferenz: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.05.2019 - 09.05.2019 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2019

Seiten: 5Sprache: EnglischTyp: PDF

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Zhang, Jun; Du, Xiong; Du, Xiao; Xiao, Wenshan; Du, Rui; Cai, Jie (State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, Chongqing, China)

In [1], we proposed a method to estimate the Cauer-type thermal parameters of IGBT module using the case temperature. This solution is developed by exploiting the relationship between the thermal parameters and time constants of case temperature cooling curves. This paper utilized the method in [1] to identify the RC parameters of multiple thermal networks corresponding to different thermal paths in the module. Experimental tests are performed to validate the accuracy and feasibility of the proposed method. This method is easy and simple to implement. Moreover, it does not need to measure the power loss of IGBT module.