The thermal and mechanical properties of reinforced AlN with metal bonding types

Konferenz: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.05.2019 - 09.05.2019 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2019

Seiten: 4Sprache: EnglischTyp: PDF

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Kwak, Manseok; Joung, Myoung-Ki; Kim, Kyong Hwan (KCC Corporation, South Korea)

The AlN ceramic is very good material for insulation substrate of power module due to its high thermal conductivity. But it has a disadvantage that the mechanical strength is lower than other ceramic substrates. So we have developed the reinforced AlN ceramic by adding the YSZ (Yttria-Stabilized Zirconia, it is called H-AlN) and evaluated the thermal and mechanical properties by making three kinds of metal bonded substrates using that. The metal bonding methods are DCB (Direct Copper Bonding), metal printed ceramic and AMB (Active Metal Brazing). In this paper, we introduce the evaluation results of normal AlN and H-AlN substrates according to different metal bonding types.