Bridging The Void Between Semiconductor Discretes and Modules in Automotive Traction Inverters

Konferenz: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.05.2019 - 09.05.2019 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2019

Seiten: 5Sprache: EnglischTyp: PDF

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Kempitiya, Asantha; Chou, Wibawa (Infineon Technologies Americas Corp., USA)

This paper introduces Infineon’s E3PAK, a novel semiconductor platform for automotive traction inverter applications ideal for bridging the void between semiconductor discrete switches and modules. This work demonstrates the electrical and thermal benefits of the proposed platform and presents a never before seeing electro-thermal performance analysis specific to electric vehicle traction application. Semiconductor characterization demonstrates that at rated current, the ultra-low package inductance and kelvin gate drive capability of the proposed package provides ~ 90% and ~30% reduction in turn on and off switching losses compared to existing Super TO-247 type solutions. The built-in electrical isolation and surface mount compatibility results in at least a ~30% reduction in thermal resistance (Rth) compared to a realization with TIM (thermal interface material). An electro-thermal loss model is developed to gain insight into an E3PAK traction inverter’s overall performance when exposed to the mechanical dynamics of an electric vehicle (EV) during the WLTP automotive drive cycle. The analysis demonstrates that an ECU when implemented with E3PAK results in a significant reduction number of discrete devices which simplifies bus bar assemblies and minimizes system size and cost.