High temperature wireless packaging of SiC power device by organic-free die-attach material sintering

Konferenz: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.05.2019 - 09.05.2019 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2019

Seiten: 7Sprache: EnglischTyp: PDF

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Liu, Lei; Ren, Hui; Zou, Guisheng; Deng, Zhongyang; Zhao, Zhenyu (Department of Mechanical Engineering, State Key Laboratory of Tribology, Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Ministry of Education of PR China, Tsinghua University, China)

This paper presents a wireless packaging design for SiC power device in order to improve junction temperature (Tj) and high-power-density reliability. Organic-free die attach material was employed to bond Cu ribbon frame for lowering inductance and increasing service temperature. Long time power cycling test was performed (ton=20s, DeltaTj>20 ºC) to evaluate packaging reliability. Thermal stress induced cracks expanded over cycles and caused the final failure because of the different thermal expansion coefficient (CTE). This high-temperature packaging design should be suitable for HEV/EV, aerospace or other harsh environment applications.