The characteristics of Sintered Copper Layer by Pressure Sintering Process for Power Module Application

Konferenz: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.05.2019 - 09.05.2019 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2019

Seiten: 4Sprache: EnglischTyp: PDF

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Yamauchi, Shinichi; Anai, Kei; Jo, Jung-Lae; Sakaue, Takahiko (Engineered Materials Sector R&D Center Mitsui Mining & Smelting Co., Ltd., Japan)
Chang, J.Y.; Fun, S.Y.; Cheng, K.H.; Cheng, H.W.; Lin, H.H.; Han, W.K.; Hsu, S.F.; Tseng, C.M.; Chang, T.C. (Intelligent Power Module & System Department, Electronics and Optoelectronics system Research Laboratories, Industrial Technology Research Institute, Taiwan, ROC)

Copper sinter materials were investigated for potential use as joining material. In this study we evaluated newly developed Cu sinter paste for joining material and studied initial joining properties and reliability with power module. The shear strength of Cu joining exceeded 70 MPa without voids in initial junction by optimizing joining conditions. Furthermore, the reliability with power module was also evaluated, which indicated no significant change of thermal resistance after TCT.