Selective Silver Sintering on Organic-Based Circuit Boards

Konferenz: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.05.2019 - 09.05.2019 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2019

Seiten: 8Sprache: EnglischTyp: PDF

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Mueller, Jonas; Maerz, Martin (Fraunhofer IISB, Germany & University Erlangen-Nuremberg, Chair for Power Electronics, Germany)
Novak, Michael (Conti Temic Microelectronic, Germany)
Dresel, Fabian; Bayer, Christoph F.; Schletz, Andreas (Fraunhofer IISB, Germany)
Hofmann, Thomas (Hofmann Leiterplatten, Germany)

Silver sintering on ceramic circuit carriers is in mass production; however, the same does not apply for sintering on standard printed circuit boards (PCB). Sintering on PCB using die transfer film (DTF) has been characterized. The selective sintering process on PCB has been developed in this work. The sizes of the dies were 18.5 mm2 to 25.75 mm2. Thereof, the process can be applied for device sizes used in power electronics. Shear tests were performed to draw conclusions from the bonding strength. The highest shear strength of 18.0 MPa was received for DTF cut-out temperature 130 ºC, substrate temperature 220 ºC and 150 s sintering time. The PCBs were not damaged during processing.