Sintering Cu Paste on Cu Plates with Different Metallization
Konferenz: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.05.2019 - 09.05.2019 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2019
Seiten: 6Sprache: EnglischTyp: PDF
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Autoren:
Takata, Shuhei; Chen, Chuantong; Gao, Yue; Suganuma, Katsuaki (Institute of Scientific and Industrial Research, Osaka University, Japan)
Inhalt:
The sinter copper (Cu) paste was developed for next generation die-attach material. The die-attach experiment by using sinter Cu paste on Cu plates with three types metallization layer (silver/nickel/gold) and without metallization layer were performed. The bonding strength was evaluated by shear strength test, which showed that sinter Cu paste exhibited different bonding performance according to the different Cu surface finish. The highest shear strength about 25.7 MPa was achieved on the Cu plate without metallization in the sintering temperature of 300 ºC, with the low pressure 0.4 MPa. The Ag metallization also showed a good shear strength similar to Cu plate without metallization. The difference of bonding performance on various metallization were further analyzed by the SEM and EDS.