Highly Reliable Package using Cu Particles Sinter Paste for Next Generation Power Devices

Konferenz: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.05.2019 - 09.05.2019 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2019

Seiten: 4Sprache: EnglischTyp: PDF

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Gao, Yue; Chen, Chuantong; Nagao, Shijo; Suganuma, Katsuaki (Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka, Japan)
Bahman, Amir Sajjad; Iannuzzo, Francesco (Department of Energy Technology, Aalborg University, Aalborg, Denmark)

A novel die-attach packaging material, sinterable Cu paste with self-reduction and self-protection properties, is proposed for high TJ semiconductor die-attach such as application in emerging wide-bandgap high-power devices. The results show that high bond strength exceeding 25 MPa can be realized by bonding at 300 °C in N2 gas under low pressure. The joints with high bonding strength survived even after 1000h thermal storage test, 1000h humidity storage test and 1000 time thermal cycles. The high strength in the mild bond-process conditions as well as the high reliability promises the opportunity of thermo-stable die-attach technology required for next generation power device packaging. Die-attach for IGBT device was also prepared followed by power cycle test.