Estimating the chip temperature in an inverter by measuring the temperature sensitive Miller plateau during turn-off
Konferenz: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07.05.2019 - 09.05.2019 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2019
Seiten: 6Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Hiller, Sebastian (SEMIKRON Elektronik GmbH & Co. KG, Germany)
Zhang, Jianjie; Lutz, Josef (Chemnitz University of Technology, Germany, Germany)
Mechanical aging of the interconnection layers of a module leads to an increasing chip temperature during operation mode. To be able to measure this increased temperature, the influence of the tem-perature on the switching parameters during switching operation can be used. One of these tempera-ture sensitive switching parameters is the Miller plateau during turn-off . In this paper, a Miller plat-eau related voltage is detected and stored during the turn-off event. The measurement is triggered by a signal of the desaturation detection instead of the turn-on signal of the IGBT in . In this paper, the measurement circuit and the measurement results are presented.