A Prospect of Hybrid Planar Power Module

Konferenz: PCIM Asia 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
26.06.2019 - 28.06.2019 in Shanghai, China

Tagungsband: PCIM Asia 2019

Seiten: 6Sprache: EnglischTyp: PDF

Persönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt

Autoren:
Yuan, Tianshu; Ning, Puqi; Cao, Han; Wen, Xuhui (University of Chinese Academy of Sciences, Institute of Electrical Engineering, China)

Inhalt:
The structure and production process of a hybrid planar power module of power semiconductor switch including SiC MOSFET in paralleling with Si IGBT will be presented. It will be illustrated in the experiment of double-pulse that hybrid planar power module is competitive in comparing with hybrid power module in traditional package.